| Title | : | ESD: Failure Mechanisms and Models |
| Author | : | |
| Rating | : | 4.74 (104 Votes) |
| Asin | : | 0470511370 |
| Format Type | : | Hardcover |
| Number of Pages | : | 408 Pages |
| Publish Date | : | 2009-08-17 |
| Genre | : |
Electrostatic discharge (ESD) failure mechanisms continue to impact semiconductor components and systems as technologies scale from micro- to nano-electronics. This book studies electrical overstress, ESD, and latchup from a failure analysis and case-study approach. It provides a clear insight into the physics of failure from a generalist perspective, followed by investigation of failure mechanisms in specific technologies, circuits, and systems. The book is unique in covering both the failure mechanism and the practical solutions to fix the problem from either a technology or circuit methodology.Look inside for extensive coverage on:
- failure analysis tools, EOS and ESD failure sources and failure models of semiconductor technology, and how to use failure analysis to design more robust semiconductor components and systems;
- electro-thermal models and technologies; the state-of-the-art technologies discussed include CMOS, BiCMOS, silicon on insulator (SOI), bipolar technol
Editorial : From the Back Cover Electrostatic discharge (ESD) failure mechanisms continue to impact semiconductor components and systems as technologies scale from micro- to nano-electronics. This book studies electrical overstress, ESD, and latchup from a failure analysis and case-study approach. It provides a clear insight into the physics of failure from a generalist perspective, followed by investigation of failure mechanisms in specific technologies, circuits, and systems. The book is unique in covering both the failure mechanism and the practical solutions to fix the problem from either a technology or circuit methodology.
Look inside for extensive coverage on:- failure analysis tools, EOS and ESD failure sources and failure models of semiconductor technology, and how to use failure analysis to design more robust semiconductor components and systems;
- electro-thermal models and technologies; the state-of-the-art technologies discussed include CMOS, BiCMOS, sil
Moreover, there are several reasons that make this book particularly valuable to a wide range of readers from new engineers/students to industry veterans.
The best way to learn about failure mechanism is not only by reading the theories, but also studying the pictures from real failure analysis experiments. Fascinating.. The book is written in metric, and Eurocode.
The design examples were short and not thorough.
Numerous references to the wrong equations throughout.
Not a great buy.. James Boswell has been called everything from an engaging gentleman to a vicious scoundrel. Even for me, English is not my first language, it is easy to read.
It is really helpful, and I recommend it if you need systematic study.
Shuyu.C. So I'm sure that there are many engineers like me who have been waiting for such a book for a long time. Mr. Simon: This was one of the best written books I have ever had the grace to read. Instead of reading the de
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